In the electronic assembly industry, the process of soldering is so significant that it determines the success or failure of a business firm. In order to facilitate this, many companies today use SMT reflow soldering oven. The initials SMT refers to surface mount technology. In this technology, highly technical principles of solder are used to bond electronic components on to the printed circuit board (PCB).
The reflow soldering is the process of joining electronic devices to the printed circuit boards as the contact pads. This requires the use of solder paste and heat to attach the components. It is the SMT reflow soldering oven that is best in this. It allows for better control of heating process that minimizes chances of defective components.
It involves joining of electrical components on to contact pads with solder paste and heat. In the process of highly controlled heating that take place in the oven, solder melts in the right position and permanently join the electrical components on PCB in the process.
Through a conveyor belt, the PCB and the mounted components are directed into the oven. This requires time and temperature precision to avoid destroying any of the components. There are four phases that these components pass through in the oven. In starts at preheat zone where time/temperature rate (ramp rate) is determined. This is important to the other zones too as it gives the correct temperature to be used. The melting point of solvent is also set here.
At thermal soak zone, the components are exposed to heat for about 60-120 seconds. The heat produced at this stage should be enough to remove all the volatiles of solder paste. The reflow zone then takes over. At this stage, the components get exposed to the maximum possible temperature which is normally set a few degrees below the maximum temperature tolerable by the component with the lowest tolerable temperature. This reduces surface tension at joints, the result of which is the bonding between pads and the electronic components.
In the fourth and final zone, the process of cooling takes place. This too is a controlled process. The heating and cooling is such controlled that the PCB and components are not exposed to thermal shock. This is perhaps what makes SMT reflow soldering oven outperform all other methods of bonding.
The heaters in these types of oven are made of ceramic materials with various options through which heat reaches the heating zones. The heat transfer can either be through hot air (radiation) and infrared electromagnetic radiation among other alternatives.
They are simpler to operate and work much faster with high accuracy level. They also have higher production level with ability to produce more that 136,000 components in a single hour. Attachment of the components can also be done on both sides at the same time with better electrical efficiency.
Electronic assembly just like any other industry is highly competitive. In order to remain a relevant market player, a firm must acquire the latest technology and most efficient production methods. The use of SMT reflow soldering oven is no longer optional in electrical assembly. In addition to higher level of production, efficiency and lower power consumption, the machine guarantees firms future survival and profitability.
The reflow soldering is the process of joining electronic devices to the printed circuit boards as the contact pads. This requires the use of solder paste and heat to attach the components. It is the SMT reflow soldering oven that is best in this. It allows for better control of heating process that minimizes chances of defective components.
It involves joining of electrical components on to contact pads with solder paste and heat. In the process of highly controlled heating that take place in the oven, solder melts in the right position and permanently join the electrical components on PCB in the process.
Through a conveyor belt, the PCB and the mounted components are directed into the oven. This requires time and temperature precision to avoid destroying any of the components. There are four phases that these components pass through in the oven. In starts at preheat zone where time/temperature rate (ramp rate) is determined. This is important to the other zones too as it gives the correct temperature to be used. The melting point of solvent is also set here.
At thermal soak zone, the components are exposed to heat for about 60-120 seconds. The heat produced at this stage should be enough to remove all the volatiles of solder paste. The reflow zone then takes over. At this stage, the components get exposed to the maximum possible temperature which is normally set a few degrees below the maximum temperature tolerable by the component with the lowest tolerable temperature. This reduces surface tension at joints, the result of which is the bonding between pads and the electronic components.
In the fourth and final zone, the process of cooling takes place. This too is a controlled process. The heating and cooling is such controlled that the PCB and components are not exposed to thermal shock. This is perhaps what makes SMT reflow soldering oven outperform all other methods of bonding.
The heaters in these types of oven are made of ceramic materials with various options through which heat reaches the heating zones. The heat transfer can either be through hot air (radiation) and infrared electromagnetic radiation among other alternatives.
They are simpler to operate and work much faster with high accuracy level. They also have higher production level with ability to produce more that 136,000 components in a single hour. Attachment of the components can also be done on both sides at the same time with better electrical efficiency.
Electronic assembly just like any other industry is highly competitive. In order to remain a relevant market player, a firm must acquire the latest technology and most efficient production methods. The use of SMT reflow soldering oven is no longer optional in electrical assembly. In addition to higher level of production, efficiency and lower power consumption, the machine guarantees firms future survival and profitability.
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